Semiconductor device package

ABSTRACT

A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/858,939 filed Dec. 29, 2017, the contents of which is incorporatedherein by reference in its entirety.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor device package and amethod of manufacturing the same.

2. Description of the Related Art

A conductive post in a semiconductor device package may move, tilt orfall because solder material between the conductive post and aconductive pad (of a substrate) is melted during thermal cycles in aprocess of manufacturing the semiconductor device package. The moved,tilted or fell conductive post may cause reliability issues of thesemiconductor device package.

SUMMARY

In one or more embodiments, a semiconductor device package includes acarrier, a first conductive post and a first adhesive layer. The firstconductive post is disposed on the carrier. The first conductive postincludes a lower surface facing the carrier, an upper surface oppositeto the lower surface and a lateral surface extended between the uppersurface and the lower surface. The first adhesive layer surrounds aportion of the lateral surface of the first conductive post. The firstadhesive layer comprises conductive particles and an adhesive. The firstconductive post has a height measured from the upper surface to thelower surface and a width. The height is greater than the width.

In one or more embodiments, a semiconductor device package includes acarrier, a conductive post, a first adhesive layer and an insulatinglayer. The conductive post is disposed on the carrier and including alateral surface. The first adhesive layer surrounds a portion of thelateral surface of the conductive post. The first adhesive layerincludes conductive particles and an adhesive. The insulating layerencapsulates the conductive post and exposes an external contact of theconductive post.

In one or more embodiments, a method for manufacturing a semiconductordevice includes disposing an adhesive layer comprising conductiveparticles and an adhesive on a carrier; disposing a pretreated orpreformed conductive post on the adhesive layer; and curing the adhesivelayer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 2A is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 2B is a schematic diagram of a cross-sectional view of thesemiconductor device package of FIG. 2B.

FIG. 3 is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 4 is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 5 is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 6A is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 6B is a cross-sectional view of a semiconductor device package inaccordance with some embodiments of the present disclosure.

FIG. 7A illustrates one or more stages of a method of manufacturing asemiconductor device package in accordance with some embodiments of thepresent disclosure.

FIG. 7B illustrates one or more stages of a method of manufacturing asemiconductor device package in accordance with some embodiments of thepresent disclosure.

FIG. 7C illustrates one or more stages of a method of manufacturing asemiconductor device package in accordance with some embodiments of thepresent disclosure.

Common reference numerals are used throughout the drawings and thedetailed description to indicate the same or similar elements.Embodiments of the present disclosure will be more apparent from thefollowing detailed description taken in conjunction with theaccompanying drawings.

DETAILED DESCRIPTION

Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,”“down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,”“lower,” “upper,” “over,” “under,” and so forth, are indicated withrespect to the orientation shown in the figures unless otherwisespecified. It should be understood that the spatial descriptions usedherein are for purposes of illustration, and that practicalimplementations of the structures described herein can be spatiallyarranged in any orientation or manner, provided that the merits ofembodiments of this disclosure are not deviated by such arrangement.

FIG. 1 is a cross-sectional view of a semiconductor device package 1 inaccordance with some embodiments of the present disclosure. Thesemiconductor device package 1 includes a carrier 10, an adhesive layer30, a dielectric layer 40, a pad 60 and a conductive post 80. Theadhesive layer 30 may include, e.g., conductive glue.

The conductive post 80 is disposed on the carrier 10. The conductivepost 80 may be, or include, a pre-formed conductive post. The conductivepost 80 includes a lower surface 801 b facing the carrier 10, an uppersurface 801 u opposite to the lower surface 801 b and a lateral surface801 s extended between the upper surface 801 u and the lower surface 801b. In some embodiments, the dielectric layer 40 includes Polypropylene(PP), Polyimide (PI), Ajinomoto Build-up Film (ABF), other suitableinsulating materials, or a combination of two or more thereof.

In some embodiments, the carrier 10 includes silicon (Si), ceramic,glass, metal, other suitable inorganic materials or a combination of twoor more thereof. The carrier 10 may be a substrate, a wafer, or a leadframe. In some embodiments, each of the pad 60 and the conductive post80 includes, for example, copper (Cu), other metal, a metal alloy, otherconductive material, or a combination of two or more thereof. Theadhesive layer 30 surrounds a portion of the lateral surface 801 s ofthe conductive post 80. In some embodiments, the adhesive layer 30includes a conductive filler such as conductive particles (such as gold(Au), silver (Ag), Cu, another metal, a metal alloy, or other conductivematerial) and an adhesive (such as epoxy resin or other resin).

In some embodiments, a thermal degradation temperature (Td) of theadhesive of the adhesive layer 30 may be higher than a reflowtemperature in a reflow process. A melting temperature of the adhesiveof the adhesive layer 30 may be higher than the reflow temperature inthe reflow process. For example, the melting temperature of the adhesivelayer 30 may higher than about 260 Degrees Celsius (° C.). Thus, theadhesive layer 30 may not be melted or reflowed at a working temperatureranging from about 25° C. to about 260° C. during a reflow process. Atleast a portion of the lateral surface 801 s of the conductive post 80may be surrounded by the adhesive layer 30, which has a relatively highmelting point, may fix or support the conductive post 80 during thermalcycles in a process of manufacturing the semiconductor device package 1.

The conductive post 80 has a height H measured from the upper surface801 u to the lower surface 801 b. In some embodiments, the height Hranges from about 410 micrometers (μm) to about 490 μm. The conductivepost 80 has a width D1. In some embodiments, the width D1 ranges fromabout 270 μm to about 330 μm. The height H of the conductive post 80 isgreater than the width D1 of the conductive post 80. The roughness ofthe lower surface 801 b may be different from the lateral surface 801 s.In some embodiments, the roughness of the lower surface 801 b is greaterthan the lateral surface 801 s. The ratio of the height H of theconductive post 80 to the width D1 of the conductive post 80 may beequal to or more than about 1.2:1, such as about 1.3:1 or greater, about1.4:1 or greater, or about 1.5:1 or greater. The relatively greatroughness of the lower surface 801 b of the conductive post 80 mayenhance the adhesion and conductivity between the lower surface 801 band the adhesive layer 30. In some embodiments, a relatively largersized conductive filler (e.g., conductive particles) of the adhesivelayer 30 is in contact with the lower surface 801 b and the pad 60. Arelatively smaller sized conductive filler of the adhesive layer 30 maybe fitted into the uneven surface 801 b of the conductive post 80 tomitigate a void issue at the lower surface 801 b of the conductive post80.

The pad 60 is disposed between the carrier 10 and the conductive post80. The dielectric layer 40 and the pad 60 are disposed on the carrier10. The dielectric layer 40 defines an opening 401 p exposing the pad60. The pad 60 can be a conductive pad. The conductive post 80 iselectrically connected to the pad 60 through the adhesive layer 30. Theconductive post 80 is electrically connected to the pad 60 by theadhesive layer 30 in the opening 401 p. In some embodiments, theconductive post 80 is not in direct contact with the pad 60, with a gapin between. In some other embodiments, at least a portion of the lowersurface 801 b is in direct contact with the pad 60.

A difference between a length D2 of the opening 401 p of the dielectriclayer 40 and a width D1 of the conductive post 80 may be equal to orgreater than about 70 The lower surface 801 b of the conductive post 80is disposed within the opening 401 p. A portion of the conductive post80 may be disposed on the dielectric layer 40. The difference betweenthe length D2 of the opening 401 p of the dielectric layer 40 and thewidth D1 of the conductive post 80 may be greater than about 70 μm sothat a portion of the lateral surface 801 s of the conductive post 80can be surrounded and supported by the adhesive layer 30.

In some embodiments, one or more conductive posts may be slightly tiltedwith respect to a surface normal of a carrier. FIG. 2A is across-sectional view of a semiconductor device package 2 in accordancewith some embodiments of the present disclosure. The semiconductordevice package 2 includes a carrier 10, adhesive layers 30 and 32, adielectric layer 40, pads 60 and 62 and conductive posts 80 and 82. Theadhesive layers 30 may include, e.g., conductive glues.

The conductive posts 80 and 82 are disposed on the carrier 10. Theconductive post 80 includes a lower surface 801 b facing the carrier 10,an upper surface 801 u opposite to the lower surface 801 b and a lateralsurface 801 s extended between the upper surface 801 u and the lowersurface 801 b. Similarly, the conductive post 82 includes a lowersurface 821 b facing the carrier 10, an upper surface 821 u opposite tothe lower surface 821 b and a lateral surface 821 s extended between theupper surface 821 u and the lower surface 821 b. In some embodiments,the dielectric layer 40 includes PP, PI, ABF, other suitable insulatingmaterials or a combination of two or more thereof. In some embodiments,the carrier 10 includes Si ceramic, glass, metal, other suitableinorganic materials, or a combination of two or more thereof. In someembodiments, each of the pads 60 and 62 and conductive posts 80 and 82includes for example, Cu, other metal, a metal alloy, other conductivematerial, or a combination of two or more thereof.

The adhesive layer 30 surrounds a portion of the lateral surface 801 sof the conductive post 80. The adhesive layer 32 surrounds a portion ofthe lateral surface 821 s of the conductive post 82. In someembodiments, the adhesive layer 30 includes a conductive filler such asconductive particles (such as Au, Ag or Cu) and an adhesive (such asepoxy resin). At least a portion of the lateral surface 801 s of theconductive post 80 may be surrounded by the adhesive layer 30, which hasa relatively high melting point, and may fix or support the conductivepost 80 during thermal cycles in a process of manufacturing thesemiconductor device package 2. Similarly, at least a portion of thelateral surface 821 s of the conductive post 82 may be surrounded by theadhesive layer 32, which has a relatively high melting point, and mayfix or support the conductive post 82 during the thermal cycles in theprocess of manufacturing the semiconductor device package 2.

As shown in FIG. 2A, the conductive post 80 has a vertical geometricalcentral axis A and the pad 60 has a vertical geometrical central axis B.The vertical geometrical central axis B of the pad 60 may be parallel toa surface normal of the carrier 10. The conductive post 82 has avertical geometrical central axis A′ and the pad 62 has a verticalgeometrical central axis B′. The vertical geometrical central axis B′ ofthe pad 62 may be parallel to the surface normal of the carrier 10. Insome embodiments, a distance (also referred to as pitch) between thevertical geometrical central axis B of the pad 60 and the verticalgeometrical central axis B′ of the pad 62 may be about 400 μm.

A tilt angle between the vertical geometrical central axis A of theconductive post 80 and the vertical geometrical central axis B of thepad 60 may be equal to or smaller than about 5 degrees, such as about 4degrees or less, or about 3 degrees or less. A tilt angle between thevertical geometrical central axis A′ of the conductive post 82 and thevertical geometrical central axis B′ of the pad 62 may be equal to orsmaller than about 5 degrees, such as about 4 degrees or less, or about3 degrees or less. A tilt angle defined by the vertical geometricalcentral axis A of the conductive post 80 relative to the verticalgeometrical central axis B of the pad 60 may be equal or smaller thanabout 5 degrees and may help to avoid bridge (short circuit) of theadjacent two conductive posts 80 and 82.

FIG. 2B is a schematic diagram of a cross-sectional view of asemiconductor device package 2 of FIG. 2A. In some embodiments, theminimum distance D3 between the two conductive posts 80 and 82 of thesemiconductor device package 2 may be about 21.56 μm. The distance D4between the bottom of the two conductive posts 80 and 82 of thesemiconductor device package 2 may be about 100 μm.

FIG. 3 is a cross-sectional view of a semiconductor device package 3 inaccordance with some embodiments of the present disclosure. Thesemiconductor device package 3 is similar to the semiconductor devicepackage 1 of FIG. 1, except that an adhesive layer 30 is not disposed ona top surface of a dielectric layer 40. Some of the same-numberedcomponents are not described again with respect to FIG. 3. Thesemiconductor device package 3 includes a carrier 10, the adhesive layer30, the dielectric layer 40, a pad 60 and a conductive post 80.

In some embodiments, the adhesive layer 30 includes a conductive fillersuch as conductive particles (such as Au, Ag or Cu) and an adhesive(such as epoxy resin). A thermal degradation temperature (Td) of theadhesive of the adhesive layer 30 may be higher than a reflowtemperature in a reflow process. A melting temperature of the adhesiveof the adhesive layer 30 may be higher than the reflow temperature inthe reflow process. For example, the melting temperature of the adhesivelayer 30 may be greater than about 260° C. The pad 60 is disposedbetween the carrier 10 and the conductive post 80. The dielectric layer40 and the pad 60 are disposed on the carrier 10. The dielectric layer40 defines an opening 401 p exposing the pad 60. The conductive post 80is electrically connected to the pad 60 through the adhesive layer 30.The conductive post 80 is electrically connected to the pad 60 by theadhesive layer 30 in the opening 401 p.

A portion of the lateral surface 801 s which is extended between theupper surface 801 u and the lower surface 801 b may be supported by theadhesive layer 30. The adhesive layer 30 is not disposed on the topsurface of the dielectric layer 40. The adhesive layer 30 contacts aportion of a side wall of the opening 401 p of the dielectric layer 40.

FIG. 4 is a cross-sectional view of a semiconductor device package 4 inaccordance with some embodiments of the present disclosure. Thesemiconductor device package 4 is similar to the semiconductor devicepackage 1 of FIG. 1, except that a portion of an adhesive layer 30 isdisposed on a top surface of a dielectric layer 40. At least some ofsame-numbered components are not described again with respect to FIG. 4.The semiconductor device package 4 includes a carrier 10, the adhesivelayer 30, the dielectric layer 40, a pad 60 and a conductive post 80.

The conductive post 80 is disposed on the carrier 10 and the dielectriclayer 40. The conductive post 80 includes a lower surface 801 b facingthe carrier 10, an upper surface 801 u opposite to the lower surface 801b and a lateral surface 801 s extended between the upper surface 801 uand the lower surface 801 b. The adhesive layer 30 surrounds a portionof the lateral surface 801 s of the conductive post 80. A portion of theadhesive layer 30 is disposed on the top surface of the dielectric layer40.

The dielectric layer 40 defines an opening 401 p exposing the pad 60.The conductive post 80 is electrically connected to the pad 60 throughthe adhesive layer 30. The conductive post 80 is disposed above the topsurface of the dielectric layer 40. The conductive post 80 iselectrically connected to the pad 60 by the adhesive layer 30 in theopening 401 p.

FIG. 5 is a cross-sectional view of a semiconductor device package 5 inaccordance with some embodiments of the present disclosure. Thesemiconductor device package 5 includes a semiconductor device package 2a, a semiconductor device package 2 b, a semiconductor device package 2c, an electronic component 20, an insulating layer 70 and solder bumps90.

The semiconductor device packages 2 a, 2 b and 2 c are similar to thesemiconductor device package 1 of FIG. 1, and at least some of thesame-numbered components are not described again with respect to FIG. 5.The semiconductor device package 2 a includes conductive posts 80 a and82 a, adhesive layers 30 a and 32 a, a dielectric layer 40, and pads 60a and 62 a. The semiconductor device package 2 b includes conductiveposts 80 b and 82 b, adhesive layers 30 b and 32 b, a dielectric layer40, and pads 60 b and 62 b. The semiconductor device package 2 cincludes conductive posts 80 c, an adhesive layer 32 c, a dielectriclayer 40, and a pad 60 c.

The conductive post 80 c may be disposed below the electronic component20. The conductive post 80 c is supported by the adhesive layer 32 c.The adhesive layer 32 c includes a conductive filler and an insulatingmaterial. The electronic component 20 is disposed on the carrier 10. Theelectronic component 10 is adjacent to the conductive posts 80 a, 82 a,80 b and 82 b. The insulating layer 70 encapsulates the electroniccomponent 20 and the conductive posts 80 a, 82 a, 80 b and 82 b. Forexample, the insulating layer 70 encapsulates the conductive posts 80 a,80 b, 82 a and 82 b and exposes the top surfaces of external contacts ofthe conductive posts 80 a, 80 b, 82 a and 82 b. In some embodiments, theroughness of a lower surface of the conductive post 80 a correspondingto the adhesive layer 30 a is different from the roughness of thelateral surface of the conductive post 80 a. The roughness of the lowersurface of the conductive post 80 a may be greater than the roughness ofthe lateral surface conductive post 80 a. In some embodiments, a tiltangle between a vertical geometrical central axis of the conductive post80 c and a vertical geometrical central axis of the pad 60 c may beequal to or smaller than 5 degrees.

FIG. 6A is a cross-sectional view of a semiconductor device package 6 ain accordance with some embodiments of the present disclosure. Thesemiconductor device package 6 a is similar to the semiconductor devicepackage 1 of FIG. 1, and some of the same-numbered components are notdescribed again with respect to FIG. 6. The semiconductor device package6 a includes a carrier 10, an adhesive layer 30, a dielectric layer 40,a pad 60 and a conductive post 80.

In some embodiments, the pad 60 includes layers 90, 91 and 92. In someembodiments, the layer 90 may include, for example, aluminum (Al), othermetal, a metal alloy, other conductive material, or a combination of twoor more thereof. In some embodiments, the layer 91 may include, forexample, titanium (Ti), other metal, r a metal alloy, other conductivematerial, or a combination of two or more thereof. In some embodiments,the layer 92 may include, for example, Cu, other metal, a metal alloy,other conductive material, or a combination of two or more thereof. Insome embodiments, the adhesive layer 30 includes a conductive fillersuch as conductive particles (such as Au, Ag or Cu) and an adhesive(such as epoxy resin). A portion of the lateral surface 801 s of theconductive post 80 is supported by the adhesive layer 30. A portion ofthe lateral surface 801 s of the conductive post 80 is surrounded by theadhesive layer 30, which have a relatively high melting point, and mayfix or support conductive post 80 during thermal cycles in a process ofmanufacturing the semiconductor device package 6 a.

FIG. 6B is a cross-sectional view of a semiconductor device package 6 bin accordance with some embodiments of the present disclosure. Thesemiconductor device package 6 b is similar to the semiconductor devicepackage 1 of FIG. 1, and some of same-numbered components are notdescribed again with respect to FIG. 6B. The semiconductor devicepackage 6 b includes a carrier 10, a dielectric layer 40, a pad 60′ anda conductive post 80.

In some embodiments, the pad 60′ includes layers 90, 91, 92, 92′, 93 and94. In some embodiments, the layer 90 may include, for example, Al, orother metal, a metal alloy, other conductive material, or a combinationof two or more thereof. In some embodiments, the layer 91 may include,for example, Ti, or other metal, a metal alloy, other conductivematerial, or a combination of two or more thereof. In some embodiments,the layer 92 may be a seed layer including, for example, Cu, or othermetal, a metal alloy, other conductive material, or a combination of twoor more thereof. In some embodiments, the layer 92′ may include, forexample, Cu, or other metal, a metal alloy, other conductive material,or a combination of two or more thereof.

In some embodiments, the layer 93 may include, for example, nickel (Ni),or other metal, a metal alloy, other conductive material, or acombination of two or more thereof. In some embodiments, the layer 93may include, for example, tin (Sn), or other metal, a metal alloy, otherconductive material, or a combination of two or more thereof. The layer93 of Sn has a relatively low melting point. The conductive post 80 maybe tilted during thermal cycles in a process of manufacturing thesemiconductor device package 6 b since the layer 93 may be reflowed.

FIGS. 7A-7C illustrate various stages of a method of manufacturing thesemiconductor device package 1. Referring to FIG. 7A, a carrier 10 isprovided. In some embodiments, the carrier 10 includes Si, ceramic,glass, metal, other suitable inorganic materials, or a combination oftwo or more thereof.

Referring to FIG. 7B, a pad 60 is disposed on the top surface of thecarrier 10. In some embodiments, the pad 60 include, for example, Cu, orother metal, a metal alloy, other conductive material, or a combinationof two or more thereof. A dielectric layer 40 is disposed on the topsurface of the carrier 10 and covers at least a portion of the pad 60.In some embodiments, the dielectric layer 40 includes PP, PI, ABF, othersuitable insulating materials, or a combination of two or more thereof.The dielectric layer 40 defines an opening 401 p exposing the pad 60.The opening 401 p of the dielectric layer 40 has a length D2. Anadhesive layer 30 is disposed in the opening 401 p and protrudes fromthe top surface of the dielectric layer 40. In some embodiments, theadhesive layer 30 includes a conductive filler such as conductiveparticles (such as Au, Ag or Cu) and an adhesive (such as epoxy resin).The disposing of the adhesive layer may include providing a stencil toprint the adhesive layer 30 on the pad 60 of the carrier 10 with apattern defined by the stencil. The stencil may include an opening toalign the pretreated conductive post 80 to connect the adhesive layer 30through the opening of the stencil.

A thermal degradation temperature (Td) of the adhesive of the adhesivelayer 30 may be higher than a reflow temperature in a reflow process. Amelting temperature of the adhesive of the adhesive layer 30 of theadhesive layer 30 may be higher than the reflow temperature in thereflow process. In some embodiments, the melting temperature of theadhesive layer 30 may be greater than about 260° C.

Referring to FIG. 7C, a pretreated or preformed conductive post 80 isdisposed on the adhesive layer 30. The disposing of the pretreatedconductive post 80 may include pressing the pretreated conductive post80 into the adhesive layer 30 before the curing of the adhesive layer30. In some embodiments, the conductive post 80 include, for example,Cu, other metal, a metal alloy, other conductive material, or acombination of two or more thereof. The lower surface 801 b of theconductive post 80 is rough. The lower surface 801 b of the conductivepost 80 may have some small voids thereon. At least a portion of theadhesive layer 30 may be filled into the voids of the lower surface 801b. A relatively smaller sized conductive filler of the adhesive layer 30may be fitted into the uneven surface 801 b of the conductive post 80 tomitigate the void issue. The relatively great roughness of the lowersurface 801 b of the conductive post 80 may enhance the adhesion andconductivity between the lower surface 801 b and the adhesive layer 30.A relatively greater sized conductive filler of the adhesive layer 30 isin contact with the lower surface 801 b and the pad 60. After disposingthe conductive post 80 into the adhesive layer 30, the adhesive layer 30is cured (e.g., hardened). Next, the semiconductor device package 1 ofFIG. 1 is obtained. A portion of the lateral surface 801 s of theconductive post 80 is surrounded by the adhesive layer 30, which have arelatively high melting point, and may fix or support conductive post 80during thermal cycles in a process of manufacturing the semiconductordevice package 1.

As used herein, the terms “approximately,” “substantially,”“substantial” and “about” are used to describe and account for smallvariations. When used in conjunction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. For example, when used in conjunction with anumerical value, the terms can refer to a variation of less than orequal to ±10% of the numerical value, such as less than or equal to ±5%,less than or equal to ±4%, less than or equal to ±3%, less than or equalto ±2%, less than or equal to ±1%, less than or equal to ±0.5%, lessthan or equal to ±0.1%, or less than or equal to ±0.05%. Thus, the term“approximately equal” in reference to two values can refer to a ratio ofthe two values being within a range between and inclusive of 0.9 and1.1.

Additionally, amounts, ratios, and other numerical values are sometimespresented herein in a range format. It is to be understood that suchrange format is used for convenience and brevity and should beunderstood flexibly to include numerical values explicitly specified aslimits of a range, but also to include all individual numerical valuesor sub-ranges encompassed within that range as if each numerical valueand sub-range is explicitly specified.

As used herein, the singular terms “a,” “an,” and “the” may includeplural referents unless the context clearly dictates otherwise. In thedescription of some embodiments, a component provided “on” or “over”another component can encompass cases where the former component isdirectly on (e.g., in physical contact with) the latter component, aswell as cases where one or more intervening components are locatedbetween the former component and the latter component.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations do not limit the present disclosure. It should beunderstood by those skilled in the art that various changes may be madeand equivalents may be substituted without departing from the truespirit and scope of the present disclosure as defined by the appendedclaims. The illustrations may not necessarily be drawn to scale. Theremay be distinctions between the artistic renditions in the presentdisclosure and the actual apparatus due to manufacturing processes andtolerances. There may be other embodiments of the present disclosurewhich are not specifically illustrated. The specification and drawingsare to be regarded as illustrative rather than restrictive.Modifications may be made to adapt a particular situation, material,composition of matter, method, or process to the objective, spirit andscope of the present disclosure. All such modifications are intended tobe within the scope of the claims appended hereto. While the methodsdisclosed herein have been described with reference to particularoperations performed in a particular order, it will be understood thatthese operations may be combined, sub-divided, or re-ordered to form anequivalent method without departing from the teachings of the presentdisclosure. Accordingly, unless specifically indicated herein, the orderand grouping of the operations are not limitations of the presentdisclosure.

What is claimed is:
 1. A semiconductor device package, comprising: asubstrate; a first conductive post disposed on the substrate; a secondconductive post disposed on the substrate, wherein the substrateincludes a first pad exposed from a first surface of the substrate and asecond pad exposed from the first surface, wherein the first conductivepost electrically connects with the second conductive post through thefirst pad and the second pad; a first adhesive layer electricallyconnecting the first conductive post to the first pad; a second adhesivelayer electrically connecting the second conductive post to the secondpad; and an insulating layer encapsulating the first conductive post andthe second conductive post, wherein a portion of a side surface of thefirst conductive post is exposed from the first adhesive layer and aportion of a side surface of the second conductive post is exposed fromthe second adhesive layer; wherein the first conductive postelectrically connects with the second conductive post by the substrate;wherein the first and second conductive post each includes an externalcontact opposite to the substrate.
 2. The semiconductor device packageof claim 1, further comprising an electronic component disposed on thesubstrate, wherein the first conductive post electrically connects withthe second conductive post through the electronic component.
 3. Thesemiconductor device package of claim 2, the substrate includes a firstpad exposed from a first surface and a second pad exposed from the firstsurface, wherein the first conductive post, the second conductive post,the first pad, the second pad, and the electronic component areelectrically connected.
 4. The semiconductor device package of claim 2,wherein the substrate includes a dielectric layer and a conductive viapenetrating the dielectric layer, the first conductive post electricallyconnects with the second conductive post through the electroniccomponent and the conductive via.
 5. The semiconductor device package ofclaim 2, wherein the electronic component includes an active componentand wherein an insulating layer is disposed between the electroniccomponent and the substrate.
 6. The semiconductor device package ofclaim 5, wherein the electronic component includes a passive component.7. The semiconductor device package of claim 1, wherein the insulatinglayer is in contact with the first conductive post and the secondconductive post, and wherein a top surface of the first conductive postand a top surface of the second conductive post are exposed from theinsulating layer.
 8. The semiconductor device package of claim 1,wherein the substrate includes a dielectric layer covering a portion ofthe first pad and a portion of the second pad, the dielectric layercontacts the first adhesive layer and the second adhesive layer.
 9. Thesemiconductor device package of claim 1, wherein the substrate includesa dielectric layer separated from the first pad and the second pad, thefirst adhesive layer contacts the dielectric layer, an upper surface anda lateral surface of the first pad, the second adhesive layer contactsthe dielectric layer, an upper surface and a lateral surface of thesecond pad.
 10. The semiconductor device package of claim 1, wherein thefirst adhesive layer comprises conductive particles and an adhesive. 11.The semiconductor device package of claim 1, wherein the first adhesivelayer surrounds a portion of the lateral surface of the first conductivepost.
 12. A semiconductor device package, comprising: a carrierincluding a first surface; a conductive post disposed over the firstsurface, the conductive post comprising a bottom surface adjacent to thecarrier, a top surface opposite the bottom surface, and a side surfaceextended between the top surface and the bottom surface; a firstadhesive layer disposed between the first surface and the conductivepost, the first adhesive layer comprising conductive particles and anadhesive; an electronic component disposed on the first surface of thecarrier; and an insulating layer encapsulating the conductive post,wherein a portion of the side surface of the conductive post is exposedfrom the first adhesive layer.
 13. The semiconductor device package ofclaim 12, wherein a portion of the insulating layer is disposed betweenthe electronic component and the carrier.
 14. The semiconductor devicepackage of claim 12, wherein the insulating layer is in contact with theconductive post and the top surface of the conductive post is exposedfrom the insulating layer.
 15. The semiconductor device package of claim12, wherein the carrier includes a first pad and a dielectric layercovering a portion of the first pad.
 16. The semiconductor devicepackage of claim 12, wherein a roughness of a lower surface of theconductive post contacting the first adhesive layer is different from aroughness of a lateral surface of the conductive post.
 17. Thesemiconductor device package of claim 16, wherein the roughness of thelower surface is greater than the roughness of the lateral surface. 18.A semiconductor device package, comprising: a carrier including a firstsurface; a conductive post disposed over the first surface; a firstadhesive layer disposed between the first surface and the conductivepost, the first adhesive layer comprising conductive particles and anadhesive; an electronic component disposed on the first surface of thecarrier; and an insulating layer encapsulating the electronic componentand conductive post, wherein the carrier includes a first pad in contactwith the first surface and a dielectric layer in contact with the firstsurface, the dielectric layer separated from the first pad by the firstadhesive layer.